JPS62115834U - - Google Patents
Info
- Publication number
- JPS62115834U JPS62115834U JP281586U JP281586U JPS62115834U JP S62115834 U JPS62115834 U JP S62115834U JP 281586 U JP281586 U JP 281586U JP 281586 U JP281586 U JP 281586U JP S62115834 U JPS62115834 U JP S62115834U
- Authority
- JP
- Japan
- Prior art keywords
- cup
- shaped
- container
- shaped container
- extraction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000605 extraction Methods 0.000 claims description 6
- 230000035622 drinking Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP281586U JPS62115834U (en]) | 1986-01-13 | 1986-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP281586U JPS62115834U (en]) | 1986-01-13 | 1986-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62115834U true JPS62115834U (en]) | 1987-07-23 |
Family
ID=30782006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP281586U Pending JPS62115834U (en]) | 1986-01-13 | 1986-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62115834U (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
| US7244637B2 (en) | 1998-09-03 | 2007-07-17 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
-
1986
- 1986-01-13 JP JP281586U patent/JPS62115834U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7244637B2 (en) | 1998-09-03 | 2007-07-17 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |